Lightweight Glass hollow sphere for engineering plastic
Lightweight hollow glass microspheres are closed-cell inorganic spherical fillers specially designed for modified engineering plastic compounds. Produced from borosilicate glass via high-temperature blowing, each bead features a complete sealed hollow structure filled with static air, delivering ultra-low density and stable physical performance.
When compounded into PA, PBT, PP, ABS and other engineering plastics, these microspheres cut the overall weight of finished plastic parts significantly. Their rigid glass shell improves dimensional stability, lowers shrinkage and warpage during injection molding. Meanwhile, the hollow cavities reduce thermal conductivity, bringing heat insulation and anti-deformation performance under temperature fluctuation.
With smooth spherical shape, they disperse evenly in plastic resin, reducing melt viscosity to boost fluidity for thin-wall molding. The material is chemically inert, acid and alkali resistant, and compatible with most reinforcing agents and additives. It is widely used in automotive structural parts, electronic housings, new energy component shells and precision engineering plastic products to realize lightweight, stable size and optimized processing performance.
Features:
- Hollow glass microspheres have a microscopic morphology of hollow spheres with a wall thickness of approximately 1-2 μm, exhibiting low density and high strength.
- Low specific gravity and high floating rate, making them widely applicable as weight-reducing materials in rubber, latex, wood substitutes, PVC plastisol, and modified resin.
- Produced using a special process, our products feature high crush strength and a high strength-to-weight ratio.
- The hollow glass microspheres are made of soda-lime borosilicate glass with a softening point of approximately 600°C, allowing them to withstand temperatures below 600°C.
- Low thermal conductivity and low dielectric constant. Glass bubbles are non-combusitable and nonporous, it creates a stable hollow structure when used in coatings or products, thus reducing thermal conductivity and dielectric constant.
- Low Alkalinity, low volatile organic compound (VOC) content, and high viscosity.
- Good flowability and low specific surface area.
- Excellent electrical insulation properties and corrosion resistance.
Technical Index
| Specific Gravity | 0.12-1.6 g/cm3 |
| Bulk Density | 0.10-0.62 g/cm3 |
| Thermal Conductivity | 0.038-0.085 W/M·K |
| PH | 8-9.5 |
| Dielectric constant | 1.2 -2.0 (100 MHz) |
Specification:
| Spec. | Ture Density (g/cm3) | Bulk Density (g/cm3) | Crush Strength (Mpa/Psi) | D50(um) | D90(um) |
| CL15 | 0.13-0.17 | 0.08-0.09 | 4/500 | 65 | 120 |
| CL20 | 0.20-0.22 | 0.10-0.12 | 4/500 | 65 | 110 |
| CL25 | 0.24-0.27 | 0.13-0.15 | 5/750 | 65 | 100 |
| CL30 | 0.29-0.32 | 0.15-0.18 | 10/1500 | 55 | 85 |
| CL32 | 0.31-0.33 | 0.17-0.19 | 14/2000 | 45 | 80 |
| CL35 | 0.33-0.37 | 0.18-0.21 | 21/3000 | 40 | 70 |
| CL38 | 0.37-0.39 | 0.19-0.22 | 38/5500 | 40 | 65 |
| CL40 | 0.39-0.42 | 0.19-0.23 | 28/4000 | 40 | 70 |
| CL42 | 0.41-0.44 | 0.21-0.24 | 55/8000 | 40 | 60 |
| CL46 | 0.44-0.48 | 0.23-0.26 | 41/6000 | 40 | 70 |
| CL50 | 0.48-0.52 | 0.25-0.27 | 55/8000 | 40 | 60 |
| CL55 | 0.53-0.55 | 0.27-0.29 | 68/10000 | 40 | 60 |
| CL60 | 0.58-0.62 | 0.29-0.34 | 83/12000 | 40 | 65 |
| CL60S | 0.58-0.63 | 0.30-0.34 | 125/18000 | 35 | 55 |
| CM10 | 1.4-1.6 | 0.45-0.50 | 193/28000 | 5 | 10 |
| CM15 | 1.2-1.3 | 0.40-0.45 | 124/18000 | 7 | 15 |
| CM20 | 1.05-1.15 | 0.39-0.44 | 124/18000 | 9 | 20 |
| CM30 | 0.9-1.0 | 0.35-0.4 | 83/12000 | 14 | 30 |
| CS20 | 0.18-0.22 | 0.10-0.12 | 7/1000 | 60 | 90 |
| CS22 | 0.20-0.24 | 0.11-0.13 | 8/1200 | 45 | 70 |
| CS28 | 0.27-0.30 | 0.15-0.17 | 28/4000 | 45 | 65 |
| CS38 | 0.36-0.40 | 0.19-0.22 | 38/5500 | 30 | 50 |
| CS42 | 0.40-0.44 | 0.21-0.24 | 55/8000 | 25 | 40 |
| CS46 | 0.44-0.50 | 0.22-0.25 | 110/16000 | 20 | 30 |
| CS60 | 0.58-0.62 | 0.29-0.33 | 193/28000 | 16 | 25 |
| CS65 | 0.63-0.67 | 0.30-0.33 | 207/30000 | 13 | 20 |
| CS70 | 0.75-0.80 | 0.33-0.35 | 207/30000 | 10 | 15 |
Applications:
- Thermal insulation paint, heat resistance coatings, and UV-resistant coatings. Applications include housing, building materials, aerospace equipment, pipelines, oil storage tanks, industrial plants, and large grain silos.
- Energy-saving building materials, thermal insulation mortar, thermal insulation putty, and noise-reducing coatings.
- Utilizing the good flowability and high crush strength of glass bubble, they are used in oilfield well cement slurry and low-density drilling fluids.
- Low-dielectric engineering plastics. Applications include 5G communication equipment, aircraft radomes, and high-frequency copper-clad laminates (CCL) for PCB circuit boards.
- Low-density silicone adhesives, epoxy resin adhesives, acrylic resin, and polyurethane adhesives. Applications include electronic potting compounds, battery potting compounds, and MS sealants.
- Lightweight engineering plastics, PVC plastisol, and structural glue. Applications include automotive plastic parts, vehicle and home appliance adhesives and sealants, and helmets.
- Anti-corrosion and antifouling coatings. Applications include automotive and marine coatings, pipeline anti-corrosion coatings, zinc-rich primers for steel structures, and weather-resistant anti-corrosion coatings.
- Rubber elastomers. Applications include rubber seals, rubber shoe soles, cable rubber layers, tires, latex products, sporting goods, and rubber everyday toys.
- Solid buoyancy materials. Applications include oil tanker hulls, underwater robot floats, fish buoys, and oil pipeline buoyancy supports.
- Epoxy tooling board. Applications include the manufacture of various molds of epoxy and polyurethane.
