Glass bubble(Microsphere) 120um filler for adhesive from China
Glass Microsphere (Glass Bubble) 120um filler for Adhesive from China is a lightweight functional filler specially developed for adhesives. It features uniform particle size, stable spherical structure and excellent dispersibility in glue systems. Adding it effectively reduces adhesive density, lowers material cost while maintaining good bonding performance. The product also brings outstanding heat insulation, sound insulation and anti-shrinkage effects to finished adhesives. It is widely applicable to various industrial adhesives, sealants and potting compounds. With high chemical stability, it won’t react with adhesive raw materials and ensures long-term service reliability.
Features for Epoxy Systems
-
Ultra‑lightweight & cost‑saving.
Density is 1/5–1/10 of epoxy resin; adding 10–30% by weight reduces part weight by 30–50% and cuts epoxy consumption, lowering overall material cost. -
Low viscosity & excellent flow. Perfect spherical shape imparts lower viscosity to epoxy mixes, improving flow and fillability for casting, potting, and laminating; enables higher filler loading without brittleness.
-
Dimensional stability & low shrinkage. Reduces epoxy cure shrinkage and thermal expansion, minimizing warpage, cracking, and internal stress in cured parts; ideal for precision components.
-
Thermal insulation & electrical insulation.Low thermal conductivity (0.03–0.05 W/m·K) enhances heat resistance; low dielectric constant and high volume resistivity make it suitable for electronic potting and insulation parts.
-
Good mechanical performance. Improves rigidity, hardness, and abrasion resistance of epoxy composites; reduces brittleness and improves impact strength compared to unfilled epoxy.
-
Chemical inertness & durability. Resistant to water, acids, alkalis, and most organic solvents; non‑absorbent, non‑flammable, and non‑toxic; compatible with all standard epoxy hardeners.
Technical Index of Glass bubble(Microsphere) 120um filler for adhesive from China:
| No. | Testing Items | Unit | Standard |
| 1 | Appearance | — | White and Good fluidity |
| 2 | Moisture | % | ≤0.50 |
| 3 | Flotation | % | ≥95 |
| 4 | Bulk Density | g/cm3 | 0.19～0.22 |
| 5 | Particle Size | µm | D90≤65 |
| 6 | Specific Gravity | g/cm3 | 0.37～0.39 |
| 7 | Crush Strength | % | 5500psi |
Specification:
| Spec. | Ture Density (g/cm3) | Bulk Density (g/cm3) | Crush Strength (Mpa/Psi) | D50(um) | D90(um) |
| CL15 | 0.13-0.17 | 0.08-0.09 | 4/500 | 65 | 120 |
| CL20 | 0.20-0.22 | 0.10-0.12 | 4/500 | 65 | 110 |
| CL25 | 0.24-0.27 | 0.13-0.15 | 5/750 | 65 | 100 |
| CL30 | 0.29-0.32 | 0.15-0.18 | 10/1500 | 55 | 85 |
| CL32 | 0.31-0.33 | 0.17-0.19 | 14/2000 | 45 | 80 |
| CL35 | 0.33-0.37 | 0.18-0.21 | 21/3000 | 40 | 70 |
| CL38 | 0.37-0.39 | 0.19-0.22 | 38/5500 | 40 | 65 |
| CL40 | 0.39-0.42 | 0.19-0.23 | 28/4000 | 40 | 70 |
| CL42 | 0.41-0.44 | 0.21-0.24 | 55/8000 | 40 | 60 |
| CL46 | 0.44-0.48 | 0.23-0.26 | 41/6000 | 40 | 70 |
| CL50 | 0.48-0.52 | 0.25-0.27 | 55/8000 | 40 | 60 |
| CL55 | 0.53-0.55 | 0.27-0.29 | 68/10000 | 40 | 60 |
| CL60 | 0.58-0.62 | 0.29-0.34 | 83/12000 | 40 | 65 |
| CL60S | 0.58-0.63 | 0.30-0.34 | 125/18000 | 35 | 55 |
| CM10 | 1.4-1.6 | 0.45-0.50 | 193/28000 | 5 | 10 |
| CM15 | 1.2-1.3 | 0.40-0.45 | 124/18000 | 7 | 15 |
| CM20 | 1.05-1.15 | 0.39-0.44 | 124/18000 | 9 | 20 |
| CM30 | 0.9-1.0 | 0.35-0.4 | 83/12000 | 14 | 30 |
| CS20 | 0.18-0.22 | 0.10-0.12 | 7/1000 | 60 | 90 |
| CS22 | 0.20-0.24 | 0.11-0.13 | 8/1200 | 45 | 70 |
| CS28 | 0.27-0.30 | 0.15-0.17 | 28/4000 | 45 | 65 |
| CS38 | 0.36-0.40 | 0.19-0.22 | 38/5500 | 30 | 50 |
| CS42 | 0.40-0.44 | 0.21-0.24 | 55/8000 | 25 | 40 |
| CS46 | 0.44-0.50 | 0.22-0.25 | 110/16000 | 20 | 30 |
| CS60 | 0.58-0.62 | 0.29-0.33 | 193/28000 | 16 | 25 |
| CS65 | 0.63-0.67 | 0.30-0.33 | 207/30000 | 13 | 20 |
| CS70 | 0.75-0.80 | 0.33-0.35 | 207/30000 | 10 | 15 |
Applications:
- Epoxy casting & tooling: Lightweight molds, master models, jigs, and fixtures (reduces weight and improves dimensional accuracy).
- Electronic potting & encapsulation: Low‑density, low‑shrinkage encapsulation for sensors, circuits, and battery modules (provides insulation, thermal management, and vibration damping).
- Composite materials & laminates: Lightweight epoxy laminates for marine, aerospace, and automotive parts (improves buoyancy and reduces structural weight).
- Adhesives & sealants: Low‑density epoxy adhesives for bonding dissimilar materials; gap‑filling sealants with low shrinkage.
- Construction & decorative materials: Epoxy flooring, terrazzo, and artificial stone (reduces weight, improves wear resistance, and enhances texture).
