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Micro Glass bubble 60um for cementing drilling Fluid

Glass bubble powder (also called hollow glass microspheres) is a white, free‑flowing powder consisting of hollow, spherical borosilicate glass particles. The 60–65 μm grade is engineered as a lightweight functional filler for epoxy resin systems, balancing low density, good strength, and easy processability.

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Micro Glass bubble 60um for cementing drilling Fluid

The Micro Glass Bubble 60µm is a high-performance solution for the oil & gas cementing industry that bridges the gap between strength and lightness. It enables operators to produce low-density cement slurries with compressive strengths, reducing well costs by decrease cement failures in challenging downhole conditions.

Glass bubble

Advantages of Micro Glass bubble 60um for cementing drilling Fluid:
1. Density Reduction:

Traditional Lightweight systems (e.g., gas, bentonite, foamed cement) often sacrifice strength. Micro bubbles allow design of low density yet high compressive strength cements.
Example: Add 10% micro bubbles can reduce slurry density by 0.2.0 while maintaining 1500+ psi compressive.

2. Slurry Stability:

Their spherical shape eliminates “dewatering” (free water separation) and reduces the need for water required for dispersion, leading to robust, settled slurries.

3. Pumpability & Placement:

Unlike low density systems (foamed cement) which require complex equipment, micro bubble slurries are easily mixed with standard centrifugal pumps and conventional cement units.

4. Thermal & Mechanical Performance:

The bubbles act as micro aggregates, distributing stresses evenly. This improves thermal (insulation) and reduces ECD (Effective Circulation Density) during.

 

Technical Index of Micro Glass bubble 60um for cementing drilling Fluid(CL42):
No.Testing ItemsUnitStandard
1AppearanceWhite and Good fluidity
2Moisture%≤0.50
3Flotation%≥95
4Bulk Densityg/cm30.19~0.22
5Particle SizeµmD90≤65
6Specific Gravityg/cm30.37~0.39
7Crush Strength%5500psi

 

Specification:
Spec.Ture Density (g/cm3)Bulk Density (g/cm3)Crush Strength (Mpa/Psi)D50(um)D90(um)
CL150.13-0.170.08-0.094/50065120
CL200.20-0.220.10-0.124/50065110
CL250.24-0.270.13-0.155/75065100
CL300.29-0.320.15-0.1810/15005585
CL320.31-0.330.17-0.1914/20004580
CL350.33-0.370.18-0.2121/30004070
CL380.37-0.390.19-0.2238/55004065
CL400.39-0.420.19-0.2328/40004070
CL420.41-0.440.21-0.2455/80004060
CL460.44-0.480.23-0.2641/60004070
CL500.48-0.520.25-0.2755/80004060
CL550.53-0.550.27-0.2968/100004060
CL600.58-0.620.29-0.3483/120004065
CL60S0.58-0.630.30-0.34125/180003555
CM101.4-1.60.45-0.50193/28000510
CM151.2-1.30.40-0.45124/18000715
CM201.05-1.150.39-0.44124/18000920
CM300.9-1.00.35-0.483/120001430
CS200.18-0.220.10-0.127/10006090
CS220.20-0.240.11-0.138/12004570
CS280.27-0.300.15-0.1728/40004565
CS380.36-0.400.19-0.2238/55003050
CS420.40-0.440.21-0.2455/80002540
CS460.44-0.500.22-0.25110/160002030
CS600.58-0.620.29-0.33193/280001625
CS650.63-0.670.30-0.33207/300001320
CS700.75-0.800.33-0.35207/300001015

 

Applications:

 

  • Epoxy casting & tooling: Lightweight molds, master models, jigs, and fixtures (reduces weight and improves dimensional accuracy).
  • Electronic potting & encapsulation: Low‑density, low‑shrinkage encapsulation for sensors, circuits, and battery modules (provides insulation, thermal management, and vibration damping).
  • Composite materials & laminates: Lightweight epoxy laminates for marine, aerospace, and automotive parts (improves buoyancy and reduces structural weight).
  • Adhesives & sealants: Low‑density epoxy adhesives for bonding dissimilar materials; gap‑filling sealants with low shrinkage.
  • Construction & decorative materials: Epoxy flooring, terrazzo, and artificial stone (reduces weight, improves wear resistance, and enhances texture).

 

The Latest News:

Glass Bubble Application and Advantages in Oilfield Cementing

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