Glass bubble powder 60-65 micron for Epoxy resin
Glass bubble powder (also called hollow glass microspheres) is a white, free‑flowing powder consisting of hollow, spherical borosilicate glass particles. The 60–65 μm grade is engineered as a lightweight functional filler for epoxy resin systems, balancing low density, good strength, and easy processability.
Features for Epoxy Systems
- Ultra‑lightweight & cost‑saving.Density is 1/5–1/10 of epoxy resin; adding 10–30% by weight reduces part weight by 30–50% and cuts epoxy consumption, lowering overall material cost.
- Low viscosity & excellent flow. Perfect spherical shape imparts lower viscosity to epoxy mixes, improving flow and fillability for casting, potting, and laminating; enables higher filler loading without brittleness.
- Dimensional stability & low shrinkage. Reduces epoxy cure shrinkage and thermal expansion, minimizing warpage, cracking, and internal stress in cured parts; ideal for precision components.
- Thermal insulation & electrical insulation.Low thermal conductivity (0.03–0.05 W/m·K) enhances heat resistance; low dielectric constant and high volume resistivity make it suitable for electronic potting and insulation parts.
- Good mechanical performance. Improves rigidity, hardness, and abrasion resistance of epoxy composites; reduces brittleness and improves impact strength compared to unfilled epoxy.
- Chemical inertness & durability. Resistant to water, acids, alkalis, and most organic solvents; non‑absorbent, non‑flammable, and non‑toxic; compatible with all standard epoxy hardeners.
Technical Index of Glass bubble powder 60-65 micron for Epoxy resin CL38:
| No. | Testing Items | Unit | Standard |
| 1 | Appearance | — | White and Good fluidity |
| 2 | Moisture | % | ≤0.50 |
| 3 | Flotation | % | ≥95 |
| 4 | Bulk Density | g/cm3 | 0.19～0.22 |
| 5 | Particle Size | µm | D90≤65 |
| 6 | Specific Gravity | g/cm3 | 0.37～0.39 |
| 7 | Crush Strength | % | 5500psi |
Specification:
| Spec. | Ture Density (g/cm3) | Bulk Density (g/cm3) | Crush Strength (Mpa/Psi) | D50(um) | D90(um) |
| CL15 | 0.13-0.17 | 0.08-0.09 | 4/500 | 65 | 120 |
| CL20 | 0.20-0.22 | 0.10-0.12 | 4/500 | 65 | 110 |
| CL25 | 0.24-0.27 | 0.13-0.15 | 5/750 | 65 | 100 |
| CL30 | 0.29-0.32 | 0.15-0.18 | 10/1500 | 55 | 85 |
| CL32 | 0.31-0.33 | 0.17-0.19 | 14/2000 | 45 | 80 |
| CL35 | 0.33-0.37 | 0.18-0.21 | 21/3000 | 40 | 70 |
| CL38 | 0.37-0.39 | 0.19-0.22 | 38/5500 | 40 | 65 |
| CL40 | 0.39-0.42 | 0.19-0.23 | 28/4000 | 40 | 70 |
| CL42 | 0.41-0.44 | 0.21-0.24 | 55/8000 | 40 | 60 |
| CL46 | 0.44-0.48 | 0.23-0.26 | 41/6000 | 40 | 70 |
| CL50 | 0.48-0.52 | 0.25-0.27 | 55/8000 | 40 | 60 |
| CL55 | 0.53-0.55 | 0.27-0.29 | 68/10000 | 40 | 60 |
| CL60 | 0.58-0.62 | 0.29-0.34 | 83/12000 | 40 | 65 |
| CL60S | 0.58-0.63 | 0.30-0.34 | 125/18000 | 35 | 55 |
| CM10 | 1.4-1.6 | 0.45-0.50 | 193/28000 | 5 | 10 |
| CM15 | 1.2-1.3 | 0.40-0.45 | 124/18000 | 7 | 15 |
| CM20 | 1.05-1.15 | 0.39-0.44 | 124/18000 | 9 | 20 |
| CM30 | 0.9-1.0 | 0.35-0.4 | 83/12000 | 14 | 30 |
| CS20 | 0.18-0.22 | 0.10-0.12 | 7/1000 | 60 | 90 |
| CS22 | 0.20-0.24 | 0.11-0.13 | 8/1200 | 45 | 70 |
| CS28 | 0.27-0.30 | 0.15-0.17 | 28/4000 | 45 | 65 |
| CS38 | 0.36-0.40 | 0.19-0.22 | 38/5500 | 30 | 50 |
| CS42 | 0.40-0.44 | 0.21-0.24 | 55/8000 | 25 | 40 |
| CS46 | 0.44-0.50 | 0.22-0.25 | 110/16000 | 20 | 30 |
| CS60 | 0.58-0.62 | 0.29-0.33 | 193/28000 | 16 | 25 |
| CS65 | 0.63-0.67 | 0.30-0.33 | 207/30000 | 13 | 20 |
| CS70 | 0.75-0.80 | 0.33-0.35 | 207/30000 | 10 | 15 |
Applications:
- Epoxy casting & tooling: Lightweight molds, master models, jigs, and fixtures (reduces weight and improves dimensional accuracy).
- Electronic potting & encapsulation: Low‑density, low‑shrinkage encapsulation for sensors, circuits, and battery modules (provides insulation, thermal management, and vibration damping).
- Composite materials & laminates: Lightweight epoxy laminates for marine, aerospace, and automotive parts (improves buoyancy and reduces structural weight).
- Adhesives & sealants: Low‑density epoxy adhesives for bonding dissimilar materials; gap‑filling sealants with low shrinkage.
- Construction & decorative materials: Epoxy flooring, terrazzo, and artificial stone (reduces weight, improves wear resistance, and enhances texture).
